CompoundSemi News Staff
May 2, 2011...Aixtron SE announced shipment of an additional next generation QXP-8300 atomic layer deposition tool to another leading Korean DRAM manufacturer. The tool shipment adds to the company's growing base of Aixtron systems installed in Asia.
“Selection of the QXP-8300 for this demanding customer clearly validates Aixtron’s proven expertise in depositing advanced and complex materials to support sub 30nm device development” said Dr. Sasangan Ramanathan, Aixtron Inc. CTO. “As device manufacturers race to fabricate higher density memory chips, the QXP-8300 product offers them the unique capability of rapid transition from R&D to high volume manufacturing,“ he further adds.
“Planned, fast installation of the QXP-8300 at this customer is allowing them to benefit very quickly from the powerful process, COO and CoC capabilities of this next generation ALD tool,” Dr. Bernd Schulte, Aixtron COO, commented. “Aixtron’s core engineering competency and IP protected technology packaged into the QXP-8300 is being widely accepted by major chip manufacturers as the only option for advanced technology nodes. The designed ability to easily and quickly install the tool delivers yet another competitive advantage in today’s aggressive chip manufacturing market,” Dr. Schulte added.
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